By Charles Harper
Fabrics layout, prototyping, and production resource
The be-all, end-all source for product designers and experts, instruction manual of Ceramics, Glasses and Diamonds tells you the way to get optimum functionality from those fabrics. The guide is choked with fabrics homes, techniques and standards info. You get choice and layout instructions and precious program insights, plus 3 chapters committed completely to diamond expertise. Written through prime fabrics specialist Charles Harper, the guide brings you in control on state of the art ceramics, glasses and diamonds and their use cutting edge use in new items, including:
* digital ceramics and complicated ceramics/composites
* complex purposes of glasses
* approach and houses of CVD diamonds
* business diamonds and diamond know-how functions
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Additional info for Handbook of Ceramics
17. The data are taken from different sources, which are identified in the table. Differences are presumed to be a result of somewhat different final compositions due to different source materials and different manufacturing procedures. 2 Nitrides. Three nitrides will be discussed in this section: aluminum nitride, which has become an important substrate material in the past decade; silicon nitride; and two forms of boron nitride—cubic and hexagonal. The characteristics of these materials are discussed in the following sections.
The 85 percent grade is a general-purpose grade regarded as the workhouse of the industry. It is economical, and provides good wear resistance and strength. Parts fabricated in the 90 percent range provide good wear resistance and strength, and dielectric properties are good for some electrical applications. The 94 percent alumina is used for multilayer electronic circuits, since it is easily metallized; it sinters at about 1700°C. Grades in excess of 96 percent are usually formed from submicrometer powders, which allows them to be fired at lower temperatures.
20 CHAPTER ONE or silver used in thick-film substrates. Hence the need for an additional plated layer after the final firing. The tape casting technology also forms the basis for construction of hermetic ceramic packages for integrated circuit chips. Such a package, in its simplest form, consists of a base layer on which the chip is mounted, a second level that forms a border around the chip mounting area, and a seal ring to which a metal cover is soldered. The second layer consists of an array of metallized fingers that in the final product run to the outside of the package.