By Pepin Press
STRUCTURAL package deal layout is a sequence of books, full of tremendous, a hundred% structurally exact, scalable packaging templates. All designs are prepared for fast use and illustrated with 2-D and 3-D structural drawings and pictures. The CD includes the templates in quite a few codecs together with EPS and PDF. additionally integrated is a demos model of Illustrator?-Plug-Ins that offer expert package deal layout percentages. This quantity ? complicated PACKAGING ? includes two hundred extra advanced designs.
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Additional info for Advanced Packaging
Far from being designed out, as most assemblers would like, measures such as underfilling are now more necessary than ever. Manufacturers can continue using the same versions of conventional capillary flow underfills for new, lead-free packages. Pre-applied underfills or corner-bond adhesives that cure during reflow offer a simplified solution. They are faster to apply, can be dispensed using ordinary SMT equipment, and cure during reflow without requiring a dedicated curing oven. But new formulas must be perfected, evaluated, and requalified as part of a complete lead-free materials solution.
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Com. 9 provides fab-wide integration and analysis of defect data generated by the WaferView standalone and integrated i-MOD ADI inspection tools for improved process yields. 9 supports all advanced capabilities of the WaferView Team for tracking macro- and micro-scale defects on the front, back, and edge of a wafer. It also acts as a central database for recipes, defect classes, and alarm rules. YieldView allows engineers to access inspection data, manage recipes, modify defect classifications, edit alarm rules, and control almost every aspect of WaferView Team operations from any PC with a Web browser and appropriate network clearance.